Project Overview

Electro-Thermal Analysis Workflow

Using ANSYS Siwave, the power network was examined for DC IR drop, current density, and power dissipation. Each of these parameters plays a crucial role in determining heat generation sources across the PCB, which were subsequently exported into Icepak for thermal modeling.

• Voltage Density Map — revealed areas of significant voltage drop due to high trace resistance.
• Current Density Map — pinpointed zones with concentrated current flow, highlighting potential reliability concerns.
• Power Density Map — visualized total dissipated energy within copper regions, serving as the foundation for thermal simulation.

a) Voltage-drop map   b) Current-density map   c) Power-density map.

Thermal Profiling and Optimization

The imported thermal data were processed in ANSYS Icepak to evaluate both passive and active cooling conditions. The baseline simulation, representing natural convection without heat sinks or fans, showed surface temperatures reaching over 240 °C, confirming the need for dedicated cooling mechanisms.

To mitigate these thermal concentrations, a custom heat-sink assembly and dual-fan configuration were added. The optimized design introduced directional airflow and improved conductive paths, resulting in a substantial reduction of temperature peaks and enhanced uniformity across the entire PCB.

a) Temperature profile under natural convection.   b) Cooling setup with fans and heat sink.

Enhanced Cooling Results

After optimization, the simulation revealed a dramatic improvement in thermal behavior:

• Maximum temperature dropped from 244 °C to 96 °C, a 60 % reduction.
• Minimum temperature remained stable at approximately 20 °C, ensuring uniform heat spread.
• Air-velocity flow improved up to ≈ 80 m/s near the fan outlets, confirming effective airflow management.

Temperature distribution comparison — left: without cooling, right: with cooling.

Air-velocity field illustrating optimized airflow across the PCB.

Key Capabilities Demonstrated

• Full electro-thermal co-simulation workflow (Siwave + Icepak)
• Accurate DC power-integrity + thermal coupling
• Parametric analysis of heat-sink and fan performance
• Design recommendations for trace widening, via density, and airflow control
• Predictive insights into reliability and lifetime under thermal stress

Applications

This workflow applies directly to clients developing:

• High-power electronics and converter boards
• RF front-end and communication PCBs
• Automotive and aerospace control modules
• Compact embedded systems with limited cooling space